Simo Sääskilahti has been appointed senior vice president, finance for Metso’s Valves business area. During the course of creating Neles Corporation, he will be nominated for CFO of Neles.

He will start in the new position on October 15th, 2019, and will report to Olli Isotalo, president of the valves business area and the future CEO of Neles.

Sääskilahti joined Metso in 2011 and he has had several top management positions in the company, most recently serving as senior vice president, valves equipment in the valves business area.

Prior to his career in Metso, he has worked in management consulting and held management positions in the software business.

Emerson has established a dedicated organization focused on digital transformation technologies and programs. The new Digital Transformation business – announced at the annual Emerson Global Users Exchange – brings together critical resources to help manufacturers develop and implement pragmatic digital transformation strategies. The $650+ million business combines existing expertise in consulting, project execution, smart sensor technologies, data management and analytics – all part of Emerson’s Plantweb digital ecosystem.

To meet the growing demand for certified drinking water supplies, Chesterton has expanded its offering of NSF 61 certified mechanical seals to include all its single cartridge seals as well as split seals.

Previously, Chesterton’s NSF products were limited to the 155 Single Cartridge Seal and the Chesterton 442 with RSC faces. The company recently received approval for ALL Chesterton single cartridge seals as well as its flagship Chesterton 442 and 442C split seals.

The certifiable seal configurations are as follows:

• 155, 150, S10 (Seal Faces: CB/SSC EP, SSC/SSC EP) including variants
• 442C, 442 (Sea Faces: CB/RSC EP, RSC/RSC/EP) including variants

Emerson awarded two 2019 ASCO Engineering Scholarships to students who demonstrated outstanding potential for leadership and contributions to the engineering profession — Shiloh Curtis, a senior at MIT, and Tristan Ott, a junior at the Missouri University of Science and Technology (Missouri S&T).

Curtis and Ott each received a $5,000 scholarship at an awards ceremony held at PACK EXPO and Healthcare Packaging EXPO 2019 in Las Vegas, produced by PMMI, the Association for Packaging and Processing Technologies. Emerson also awarded two grants of $1,000 to benefit the engineering departments of MIT and Missouri S&T.