Emerson announces the application period is now open for its 2020 ASCO Engineering Scholarship Program for U.S. college students. The merit-based scholarships are awarded on the candidate's potential for leadership and for making a significant contribution to the engineering, instrumentation, systems, and automation professions. Recipients may also be eligible for an Emerson internship.
The scholarship recipients will be announced at PACK EXPO International on November 11 in Chicago. There, Emerson will host the recipients at its Amazing Packaging Race. The deadline to apply is May 1, 2020.